三星�(qiáng)�(diào)TSV的功能,“對促�(jìn)移動(dòng)DRAM和圖形DRAM的�(jìn)化極為重�”
摘要�2010�2�7日,也就是半�(dǎo)體電路技�(shù)國際會議“ISSCC 2010”演講開始的前一天,以三維半�(dǎo)體技�(shù)為核心的技�(shù)論壇“Silicon 3D-Integration Technology and Systems”召開。其中備受關(guān)注的是韓國三星電子發(fā)表的“TSV Technology and its Application to DRAM
閱讀�11962010�02�11� 22:43:54