元器件交易網� 4�2日消�,據外媒報道,日月光半導體公司(ASE)計劃與華亞科技聯合成立合資公司,該公司主要對器件使�3D封裝TSV(高密度的硅穿孔)技��
ASE和華亞科已經談判有一年多,并預計很快進入進程,該合資企業很可能被設置在華亞科技的閑置廠房或日月光工廠中。兩家公司最初的生產目標是每月推�1萬片3D IC芯片,預計將擴大TSV封裝范圍,包括應用處理器和移動RAM芯片。(元器件交易網 白玉濤譯�
以下為外文:
在ASE-華亞科合資公司也有可能與臺灣半導體制造公司(TSMC)在3D IC封裝業競爭,該消息人士指�。Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.
ASE and Inotera have been in talks for over a year and are expected to finalize the deal soon, said the sources, adding that the joint venture is likely to be set up either at a Inotera's idle plant or at a ASE plant in Chungli, north Taiwan.
Initial production aims are to roll out 10,000 3D IC chips a month, said the sources, adding that the two firms are expected to expand the TSV packaging technology to include application processors and mobile RAM chips.
The ASE-Inotera joint venture is also likely to compete with Taiwan Semiconductor Manufacturing Company (TSMC) in the 3D IC packaging sector, the sources noted.
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